Key Applications

- High Performance Computing
- Hyper-Converged Infrastructure
- Big Data / Big Science
- Oil immersion, Liquid Cooling


Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP

2. 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM

3. 2 PCI-E 4.0 x16 (LP) slot, 1 PCI-E 4.0 x8 (LP) slot

4. 6 Hot-swap 2.5" drive bays

5. Intel® X710 Dual port 10GBase-T LAN onboard

6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

7. 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)

8. 2200W redundant Titanium level power supplies

Product Details