Key Applications

- High Performance Computing
- Hyper-Converged Infrastructure
- Big Data / Big Science
- Oil immersion, Liquid Cooling


Key Features

Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP

2. 16 DIMMs Supports; up to 4TB DDR 4-3200 

3. 2 PCI-E 4.0 x16 (LP) slot, 1 PCI-E 4.0 x8 (LP) slot

4. 4x 2.5" hot-swap SATA/SAS drive bays

5. Intel® X710 Dual port 10GBase-T LAN onboard

6. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN

7. 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System)

8. 1000W redundant Titanium level power supplies

Product Details